H - Electricity
01
L
H01L 23/34 (2006.01) H01L 23/40 (2006.01)
Patent
CA 2341076
Disclosed is a heat sink including a body being in contact with a heat emitting surface of an integrated circuit package serving as a heat emitting body, heat discharge fins integrally formed with the body and adapted to discharge heat transmitted thereto, shafts integrally formed with the body so that they are protruded from a surface of the body facing the heat emitting surface, each of the shafts extending through an associated one of through holes formed at a printed circuit board to which the integrated circuit package is mounted, compression coil springs each fitted around a protruded portion of the associated shaft, each compression coil spring serving to apply an elastic support force to the printed circuit board, and retaining means adapted to enlarge the protruded portion of the associated shaft, thereby preventing the associated coil spring from being separated from the associated shaft. Since the shafts are firmly retained by the ring members, the heat sink can be easily assembled and disassembled with respect to the printed circuit board. Accordingly, an improvement in workability is achieved. A uniform pressure is applied between the heat emitting surface of the integrated circuit package and the body of the heat sink, so that it is possible to stably maintain a desired heat discharge effect of the heat sink.
Hill & Schumacher
Samsung Electro-Mechanics Co. Ltd.
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