A high performance epoxy based laminating adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 201/02 (2006.01) B32B 7/12 (2006.01) C08G 18/40 (2006.01) C08G 18/83 (2006.01) C09J 163/00 (2006.01) C09J 175/04 (2006.01) C09J 175/06 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2133839

2133839 9320123 PCTABS00027 A process for producing an improved three-dimensional polymeric adhesive material comprises: (1) reacting a starting polymer containing an active hydrogen or hydroxy function with a polyfunctional nucleophile to form an adduct product; and (2) reacting the adduct product with a polyelectrophile to generate a three-dimensional polymeric adhesive material. Preferably, the starting polymer is a high molecular weight polyester, the polyfunctional nucleophile is a polyisocyanate, and the polyelectrophile is at least one polyepoxide. The present invention also encompasses processes for bonding at least two substrates by generating the adhesive material between them, as well as the adhesive material itself. The invention is particularly suitable for bonding electronic components such as printed circuit boards.

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