A housing for electronic circuits and components

Details A housing for electronic circuits and components A housing for electronic circuits and components

H - Electricity

05

K

H05K 7/20 (2006.01) H05K 7/14 (2006.01)

Patent

CA 2505313

The invention relates to a heat dissipating internally fan-less housing (20) for electronic circuits and components (28). The housing comprises an assembly of two container (10) parts comprising heat-sink fins (12). Each part has a substantially diagonal (14) shaped profile. In the housing a circuit-board (29) is mounted along the diagonal (14) profile thus providing that the long- side ends of the circuit-board (29) on each side of the board are covered by a greater mass of heat-sink fins (12) compared to a horizontally mounted circuit board for a better cooling of components.

La présente invention concerne un boîtier (20) à dissipation thermique interne sans ventilateur, destiné à des circuits et des composants électroniques (28). Le boîtier comprend un ensemble de deux parties de réception (10) comprenant des nervures de dissipation thermique (12). Chaque partie a un profil de forme sensiblement diagonale (14). Le boîtier contient une carte de circuits imprimés (29) qui est montée le long du profil en diagonale (14) de sorte que les extrémités du plus long côté de la carte de circuits imprimés (29) sont recouvertes, de chaque côté de ladite carte, d'une masse de nervures de dissipation thermique (12) qui est supérieure à celle d'une carte de circuits imprimés montée horizontalement, ce qui permet d'obtenir un meilleur refroidissement des composants.

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