C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 9/02 (2006.01) C22C 9/04 (2006.01)
Patent
CA 2458718
A lead-free copper alloy on the base of Cu-Zn-Sn and its use. The copper alloy is built on the base of copper, zinc and tin without toxic additives and consists of: 60 to 70% Cu, 0.5 to 3.5% Sn and the further matrix- active elements: 0.01 to 0.5% Fe and/or Co, 0.01 to 0.5% Ni, 0.01 to 0.5% Mn and/or Si, the remainder Zn and unavoidable impurities. Selectively up to 3% Mg, up to 0.2% P and up to 0.5% Ag, Al, As, Sb, Ti, Zr can be added. The demands for a health-conscious and ecological compatibility are thus naturally met.
Boegel Andreas
Breu Monika
Hofmann Uwe
Seeger Joerg
Siegele Harald
Borden Ladner Gervais Llp
Wieland-Werke Ag
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