A metallic building element for optoelectronics

G - Physics – 02 – B

Patent

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Details

G02B 6/42 (2006.01) G02B 6/36 (2006.01)

Patent

CA 2340987

The present invention relates to a method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range. Starting from a silicon master or original that can be etched to sub-micrometer precision and then plated with a metal, such as nickel (3), on the silicon surface, there can be produced a nickel shim where precision and surface fineness can lie in the sub- micrometer range. Subsequent to removal of the silicon master, a photo- sensitive material (5) can be used in liquid form or in film form to create mould cavities (9) that reach down to the nickel shim. These cavities can then be metal-plated to provide a building element (8) of higher precision in three dimensions.

La présente invention porte sur un procédé visant à structurer des éléments de construction métalliques, et également sur un élément de construction métallique, la précision de mesure obtenue pouvant se situer dans la plage du sous-micromètre. A partir d'un original au silicium qui peut être attaqué à l'acide au sous-micromètre près et ensuite recouvert de métal tel que du nickel (3) sur la surface de silicium, il est possible de produire une cale de nivellement en nickel dont la précision et la finesse de la surface peuvent se situer dans la plage du sous-micromètre. Après le retrait de l'original, un matériau (5) photosensible peut être utilisé sous forme liquide ou sous forme d'un film pour créer des cavités (9) de moulage qui rejoignent la cale de nivellement en nickel. Ces cavités peuvent être recouvertes de métal pour former un élément (8) de construction de haute précision en trois dimensions.

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