A method and an arrangement for mounting a component on a...

H - Electricity – 05 – K

Patent

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H05K 3/32 (2006.01) H05K 1/18 (2006.01) H05K 3/30 (2006.01) H05K 3/36 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2222319

There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

L'industrie électronique a tendance à préférer les composants montables en surface sur support, par exemple une carte de circuit. En utilisant des conducteurs montables en surface sur un composant conjointement avec une technique de montage à une seule rangée de connexions, il est possible de monter en surface un composant (5) debout sur une carte de circuit (7), ses conducteurs étant montés en surface sur la carte. Les conducteurs (8) peuvent être pliés à leurs extrémités inférieures et dotés de pattes (10) assurant un contact efficace avec la carte. Des broches-guides et des broches de soutien peuvent servir à tenir le composant en place pendant le montage et la connexion du composant et à assujettir les conducteurs sur le composant lors du montage sur la carte.

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