A method and an arrangement for the electrical contact of...

Details A method and an arrangement for the electrical contact of... A method and an arrangement for the electrical contact of...

H - Electricity

05

K

H05K 3/32 (2006.01) H01L 23/34 (2006.01) H01L 23/36 (2006.01) H01L 23/498 (2006.01) H05K 1/02 (2006.01) H05K 1/14 (2006.01) H05K 3/34 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2368057

The present invention relates to a method and to an arrangement for connecting a component, such as a chip (6), on a substrate (7) to a conductive surface of a carrier, such as an earth plane (10) on a printed circuit board (8) having a conductive layer (11) in a so-called compact design.

La présente invention concerne un procédé et un dispositif de connexion d'un composant, tel qu'une puce (6) sur un substrat (7), à la surface conductrice d'un support tel qu'un plan de terre (10) sur une carte à circuit imprimé (8) possédant une couche conductrice (11) dans une configuration dite compacte.

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