H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H01Q 1/38 (2006.01) H01Q 21/00 (2006.01) H05K 3/10 (2006.01) H05K 3/22 (2006.01) H05K 3/30 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2671251
There is disclosed a method for making a three-dimensional interconnect device, the device comprising a plurality of interconnection layers. The method comprises a step of laminating a printed circuit board comprising a plurality of interconnection layers. The method comprises a step of inserting the printed circuit board in a three- dimensional mold. The method comprises a step of injecting a molding material into the mold, so as to form a three-dimensional structure encompassing the printed circuit board. The method comprises a step of metallizing a portion of the outer surface of the three-dimensional structure, so that it is connected with at least one interconnection layer of the printed circuit board. Application : detection, telecom.
Marks & Clerk
Thales Nederland B.v.
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