A method for the partial metallization of a substrate

D - Textiles – Paper – 21 – H

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

D21H 19/02 (2006.01) B05D 1/28 (2006.01) B41M 5/025 (2006.01) B44C 1/17 (2006.01)

Patent

CA 2167211

A process for the selective metallization of a substrate (10) and the product formed thereby. An extremely thin (substantially less than the wavelength of light) coat of metallic particles is deposited on a transfer agent. A thin coat of varnish (40) is selectively applied to either the substrate (10) or the transfer agent, the substrate (10) or transfer agent are laminated together and the varnish (40) is cured. The metallic particles will become absorbed within the varnish (40) and the substrate (10) and transfer agent are then separated. The substrate (10) is provided with a highly polished specular metallic finish in predetermined areas.

L'invention concerne un procédé de métallisation sélective d'un substrat (10) et le produit ainsi obtenu. Un film extrêmement mince (sensiblement inférieur à la longueur d'onde de la lumière) de particules métalliques est déposé sur un agent de transfert. Un mince film de vernis (40) est appliqué d'une manière sélective soit sur le substrat (10), soit sur l'agent de transfert, le substrat (10) et l'agent de transfert sont stratifiés ensemble et le vernis (40) est durci. Les particules métalliques sont absorbées dans le vernis (40), et le substrat (10) et l'agent de transfert sont alors séparés. Le substrat (10) est pourvu d'un fini métallique spéculaire hautement poli dans des zones prédéterminées.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

A method for the partial metallization of a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with A method for the partial metallization of a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and A method for the partial metallization of a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1824142

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.