A method for treating contact leads on electrochemical cells...

H - Electricity – 01 – M

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Details

H01M 2/06 (2006.01) H01M 2/08 (2006.01) H01M 2/26 (2006.01) H01M 2/30 (2006.01) H01M 10/04 (2006.01) H01M 10/40 (2006.01)

Patent

CA 2302980

The present invention provides a method of hermetically sealing an electrochemical cell. In the disclosed method, a coating of an adhesive composition is applied to an external metal tab that serves as a contact lead from the cell to a device within which the cell is employed. The adhesive coats and heremetically seals the tab surface thereby. The coating process can be executed by directly heat-sealing an adhesive film onto the tab surface. Alternatively, an aqueous suspension of the adhesive composition can be sprayed onto the tab surface, or the tab may be roll coated in the composition and thereafter subjected to heat treatment, causing the adhesive to melt and flow. The coated tab is thereafter welded to a corresponding current collector in the form of a metal foil. The complete cell assembly is heat-sealed in a final closure sealing member such that the sealed tabs extend therethrough.

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