H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/00 (2006.01) B81C 1/00 (2006.01) G01J 5/12 (2006.01) G01N 21/35 (2006.01) G02B 6/36 (2006.01) G02B 6/42 (2006.01) H01L 21/48 (2006.01)
Patent
CA 2320920
The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3") or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mould, such as by moulding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mould.
L'invention concerne un procédé relatif à la fabrication d'un composant électrique, électronique, électromécanique et/ou mécanique (12), sachant que l'on donne au substrat du composant une structure ou une configuration tridimensionnelle (3'') et que ledit substrat se prête à un traitement ultérieur qui permet de constituer le composant (12). Le substrat est mis en forme au moyen d'une matrice ou d'un moule (par exemple, moulage, bombage, extrusion ou emboutissage), et la précision nécessaire requise aux fins du composant dans la structure tridimensionnelle résulte de la mise en oeuvre d'un procédé d'usinage micromécanique propre à la fabrication de la matrice ou du moule.
Martin Hans Goran Evald
Ohman Per Ove
Amic Ab
Smart & Biggar
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