A method of forming a mold and molding a micro-device

B - Operations – Transporting – 29 – C

Patent

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B29C 33/38 (2006.01) B22F 5/00 (2006.01) B29C 33/42 (2006.01) B29C 45/00 (2006.01) B81B 1/00 (2006.01) A61B 17/20 (2006.01)

Patent

CA 2491839

A method of forming a device including a plurality of micron or sub-micron sized features is provided. A master having a surface contour defining a plurality of features is provided. The surface contour of the master is coated with at least one layer of material to form a shell. The master is removed from the shell to form a negative image of the surface contour in the shell. The negative image in the shell is filled with material, for example, polycarbonate, polyacrylic, or polystyrene, to form a device having features substantially the same as the master. The negative image may be filled using injection molding, compression molding, embossing or any other compatible technique.

L'invention concerne un proc~d~ de formage d'un dispositif comportant une pluralit~ de caract~ristiques de la taille du micron ou du sous-micron. Elle concerne une matrice dont le contour superficiel d~finit une pluralit~ de caract~ristiques, ledit contour superficiel ~tant revÚtu d'au moins une couche de mat~riau pour former une enveloppe. La matrice, enlev~e de l'enveloppe, forme une image n~gative du contour superficiel dans l'enveloppe. Ladite image n~gative dans l'enveloppe est remplie de mat~riau, par exemple du polycarbonate, polyacrylique ou polystyr­ne, de fa×on ~ former un dispositif dont les caract~ristiques sont sensiblement identiques ~ celles de la matrice. L'image n~gative peut Útre remplie par moulage par injection, par moulage par compression, par bosselage ou par toute autre technique compatible.

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