A method of making a wafer-pair having sealed chambers

Details A method of making a wafer-pair having sealed chambers A method of making a wafer-pair having sealed chambers

H - Electricity

01

L

H01L 21/00 (2006.01) B81B 1/00 (2006.01) B81C 1/00 (2006.01) H01L 27/16 (2006.01) H01L 31/0203 (2006.01)

Patent

CA 2326677

A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.

Cette invention a trait à un procédé de production d'une paire de tranches dans l'une desquelles au moins est ménagé un évidement formant une enceinte avec la fixation de l'autre tranche dont l'orifice est obturé à l'aide d'un revêtement déposé sur sa face extérieure. La mise en place de ce revêtement peut s'effectuer dans un environnement à très basse pression, ce qui garantit l'existence d'un environnement identique dans l'enceinte close. L'enceinte peut renfermer au moins un dispositif tel qu'un capteur thermoélectrique, un bolomètre, un émetteur ou un autre type de dispositif. Cette paire de tranches, qui comporte, d'ordinaire, plusieurs enceintes renfermant des dispositifs, peut être divisée en plusieurs microplaquettes.

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