A method of manufacturing a substrate for placement of...

Details A method of manufacturing a substrate for placement of... A method of manufacturing a substrate for placement of...

H - Electricity

05

K

H05K 1/05 (2006.01) H05K 3/44 (2006.01)

Patent

CA 2046615

In a method for manufacturing of substrate for placement of electrical and/or electronical components a base of prefer- ably metallic material is first sandblasted and thereafter by means of a thermal process coated with a bonding layer of for in- stance copper powder, whereafter the bonding layer are coated with a dielectric layer of ceramic material which also is applied by means of a thermal process, the ceramic material thereafter being impregnated with silicone oil. Thereafter the ceramic layer is provided with a dielectric conducting layer, also by means of a thermal process, the predetermined conducting pattern being formed by means of a template. Finally the finished substrate is cleaned by blasting with glass spheres.

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