A method of reducing high frequency coupling between pairs...

H - Electricity – 05 – K

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H05K 1/02 (2006.01) H05K 1/11 (2006.01) H01R 13/658 (2006.01)

Patent

CA 2311802

In order to reduce high frequency signal coupling between conductors in pairs in connectors (1, 2), said conductors consisting of connecting conductors in pairs (A+, A-; B+, B-; C+, C-; D+, D-), which are embedded in a dielectric (14), and contact springs, two layers are provided on the sides of the contact springs which are not to touch other contact springs, the first layer being a dielectric, the second layer being an electrically conductive shield (13). Furthermore, the dielectric, which surrounds the connecting conductors, is partially replaced by electrically conductive shields. A reduction in signal coupling between two sets of conductors in pairs may be obtained hereby.

Afin de réduire le couplage de signaux haute fréquence entre des conducteurs par paires dans des connecteurs (1, 2), lesdits conducteurs étant constitués de conducteurs de connexion par paires (A¿+?, A¿-?; B¿+?, B¿-?; C¿+?, C¿-?; D¿+?, D¿-?) noyés dans un diélectrique (14) et des ressorts de contact, on applique deux couches sur les côtés des ressorts de contact qui ne doivent pas toucher d'autres ressorts de contact, la première couche étant un diélectrique et la seconde couche étant un écran (13) électriquement conducteur. Le diélectrique entourant les conducteurs de connexion est partiellement remplacé par des écrans électriquement conducteurs. On peut ainsi réduire le couplage de signaux entre deux ensembles de conducteurs par paires.

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