A modular mezzanine connector

H - Electricity – 01 – R

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01R 13/514 (2006.01) H01R 12/16 (2006.01) H01R 13/506 (2006.01) H01R 33/76 (2006.01)

Patent

CA 2394432

A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts. If a larger stack height is desired, a spacer can be attached to the base of either or both the plug or the receptacle to achieve a larger stack height.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

A modular mezzanine connector does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with A modular mezzanine connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and A modular mezzanine connector will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1833986

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.