A moisture-curing compound

C - Chemistry – Metallurgy – 09 – K

Patent

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Details

C09K 3/10 (2006.01) C09D 5/34 (2006.01) C09J 127/06 (2006.01) C09J 175/04 (2006.01) C08L 75/00 (2006.01)

Patent

CA 2218298

Described is a moisture-curing sealing and bonding compound made from completely synthetic polymers, the compound containing, to improve its non-sag properties, a triglyceride, either as the sole non-sag agent or in addition to prior art agents. The triglyceride should have a melting point over 40 deg C, preferably over 50 deg. C, and be derived from saturated fatty acids with 8 to 26 C-atoms. Even without using thixotropic agents, compounds can be obtained which do not sag at temperatures over 40 deg. C. Such joint sealants can be used to fill joints more than 35 mm wide without sagging.

L'invention a pour objet un matériau durcissant à l'humidité pour l'étanchéification et le collage, à base de polymères entièrement synthétiques qui, en vue d'améliorer sa résistance au fluage, renferme, en plus des agents connus jusqu'à présent, voire même exclusivement, un triglycéride. Ce triglycéride présente un point de fusion supérieur à 40 DEG C, en particulier, supérieur à 50 DEG C, et est dérivé d'acides gras saturés comportant 8 à 26 atomes de carbone. On obtient ainsi, même sans agents thixotropes, des matériaux qui résistent au fluage à des températures supérieures à 40 DEG C. Avec de tels matériaux d'étanchéification, des joints d'une largeur supérieure à 35 mm peuvent être colmatés et résister au fluage.

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