A molding material and a molded article

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 59/62 (2006.01) C08G 8/28 (2006.01) C08G 14/12 (2006.01) C08J 3/24 (2006.01) C08J 5/24 (2006.01) C08L 61/06 (2006.01) C08L 61/14 (2006.01) C08L 63/00 (2006.01)

Patent

CA 2399736

A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfaalkylated so as to have improved hydrophilicity.

L'invention porte sur une composition de résine phénolique dans laquelle la résine phénolique peut être légèrement durcie à basse température tout en inhibant la génération de formaldéhyde libre et en piégeant un phénol libre. Un composé époxy est dispersé ou dissous sous forme d'agent de réticulation dans une solution aqueuse de résine phénolique. Le composé époxy n'agit pas comme un agent de réticulation de la résine phénolique, mais comme un agent piégeur du phénol libre. La résine phénolique a été sulfoalkylée et/ou sulfa-alkylée de façon à avoir une meilleure hydrophilie.

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