C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 22/08 (2006.01) C23C 22/12 (2006.01) C23C 22/18 (2006.01) C23C 22/22 (2006.01)
Patent
CA 2133455
2133455 9320259 PCTABS00027 The invention concerns a process for the manufacture of copper-containing nickel-free phosphate films, with a defined copper content and a defined phosphate-crystal edge length, on metal surfaces, using phosphatization solutions which, in addition to zinc, copper and phosphate ions, contain hydroxylammonium salts, hydroxylamine complexes and/or hydroxylamine as accelerators.
Brouwer Jan-Willem
Gottwald Karl-Heinz
Hamacher Matthias
Roland Wolf-Achim
Henkel Kommanditgesellschaft Auf Aktien
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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