A nickel-free phosphating process

C - Chemistry – Metallurgy – 23 – C

Patent

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C23C 22/08 (2006.01) C23C 22/12 (2006.01) C23C 22/18 (2006.01) C23C 22/22 (2006.01)

Patent

CA 2133455

2133455 9320259 PCTABS00027 The invention concerns a process for the manufacture of copper-containing nickel-free phosphate films, with a defined copper content and a defined phosphate-crystal edge length, on metal surfaces, using phosphatization solutions which, in addition to zinc, copper and phosphate ions, contain hydroxylammonium salts, hydroxylamine complexes and/or hydroxylamine as accelerators.

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