B - Operations – Transporting – 24 – D
Patent
B - Operations, Transporting
24
D
B24D 3/10 (2006.01) B22F 7/06 (2006.01) C04B 37/02 (2006.01) C23C 30/00 (2006.01)
Patent
CA 2308684
The present invention provides a diamond sintered compact tool, which is excellent in economy as well as cutting edge strength. A diamond sintered compact cutting tool comprising a diamond sintered compact sintered at an ultra-high pressure and high temperature and a WC-Co type cemented carbide substrate directly bonded to the diamond sintered compact during a step of sintering and brazed to a tool base through the WC-Co type cemented carbide substrate in which a ratio of the thickness of the WC-Co type cemented carbide substrate to the thickness of the diamond sintered compact layer satisfies the relation of: 0.8 ~ WC-Co type cemented carbide substrate/diamond sintered compact layer ~ 3.0 and the diamond sintered compact layer has a thickness of 0.05 mm to 0.5 mm, preferably 0. 05 mm to 0. 45 mm, more preferably 0. 12 mm to 0. 36 mm.
Nakai Tetsuo
Shiraishi Junichi
Yoshida Katsuhito
Marks & Clerk
Sumitomo Electric Industries Ltd.
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