A polycrystal diamond tool

Details A polycrystal diamond tool A polycrystal diamond tool

B - Operations, Transporting

24

D

B24D 3/10 (2006.01) B22F 7/06 (2006.01) C04B 37/02 (2006.01) C23C 30/00 (2006.01)

Patent

CA 2308684

The present invention provides a diamond sintered compact tool, which is excellent in economy as well as cutting edge strength. A diamond sintered compact cutting tool comprising a diamond sintered compact sintered at an ultra-high pressure and high temperature and a WC-Co type cemented carbide substrate directly bonded to the diamond sintered compact during a step of sintering and brazed to a tool base through the WC-Co type cemented carbide substrate in which a ratio of the thickness of the WC-Co type cemented carbide substrate to the thickness of the diamond sintered compact layer satisfies the relation of: 0.8 ~ WC-Co type cemented carbide substrate/diamond sintered compact layer ~ 3.0 and the diamond sintered compact layer has a thickness of 0.05 mm to 0.5 mm, preferably 0. 05 mm to 0. 45 mm, more preferably 0. 12 mm to 0. 36 mm.

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