A pressure transducer

H - Electricity – 04 – R

Patent

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Details

H04R 19/00 (2006.01) G01L 9/00 (2006.01)

Patent

CA 2383901

The present invention relates to compact solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is easier and more economical to manufacture compared to any other system disclosed in prior art. In addition the invention is compatible with electronic equipment manufacturing processes, such as SMD pick and place techniques. The invention uses a transducer chip comprising a chamber, a diaphragm that is positioned at the first lower surface and covering the second opening of the transducer chip. The transducer chip is flip-chip mounted onto a post-processed chip also comprising a chamber. The microphone system can be electrically connected to an external substrate by conventional techniques such as wire bonding.

La présente invention concerne des systèmes de microphones compactes à condensateur semi-conducteur à base de silicium qui conviennent à la production en petite série. La combinaison des différents éléments constituant le système de microphones est plus simple et plus économique lors de la fabrication, comparée à tout autre système de la technique antérieure. En outre, lesdits systèmes de cette invention sont compatibles avec des procédés de fabrication de matériels électroniques, tels que les techniques de mise en place CMS. Lesdits systèmes de l'invention utilisent une puce de transducteur comprenant une chambre, un diaphragme placé au niveau de la première surface inférieure et couvrant la seconde ouverture de ladite puce. Celle-ci est une puce à protubérances fixée sur une puce post-traitée qui contient aussi une chambre. Le système de microphones peut être connecté électriquement à un substrat externe au moyen de techniques traditionnelles telles que la microsoudure de fils.

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