A printed circuit board

H - Electricity – 05 – K

Patent

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Details

H05K 1/02 (2006.01) H05K 7/20 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2378252

The present invention relates to a method of providing thermal vias in a printed circuit board for conducting heat from surface mounted components through said board and away therefrom. One or more holes are formed in a board material that includes a metal layer on a top side and a bottom side thereof, to form said printed circuit board. Metal plugs are pressed into the holes and affixed therein so as to seal against an inner wall of said holes in said metal layers, by causing the plugs to expand radially in said holes. A conductor pattern that includes electrical connection sites is then provided on the board material, such as to obtain said printed circuit board. The invention also relates to a printed circuit board that includes vias arranged in accordance with the aforesaid method.

La présente invention concerne un procédé permettant de former des traversées thermiques sur une carte à circuit imprimé, de manière à assurer la conduction thermique à partir de composants montés sur une surface et à travers la carte. Ce procédé consiste tout d'abord à former un ou plusieurs orifices sur le corps de la carte, lequel présente une couche métallique sur ses côtés supérieur et inférieur afin de constituer ladite carte à circuit imprimé. Puis ce procédé consiste à insérer et à fixer des fiches métalliques dans ces orifices, de sorte qu'une paroi intérieure de ces orifices est pressée hermétiquement contre les couches métalliques, ce qui amène les fiches à s'étendre de manière radiale dans lesdits orifices. Ce procédé consiste ensuite à former un réseau de conducteurs, qui présente des emplacements de connexion électrique, sur le corps de la carte, afin de produire une carte à circuit imprimé. Cette invention concerne enfin une carte à circuit imprimé avec des traversées formées selon le procédé susmentionné.

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Profile ID: LFCA-PAI-O-1976226

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