A raw substrate used for manufacturing an insurating...

H - Electricity – 05 – B

Patent

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H05B 1/00 (2006.01) G03G 15/20 (2006.01) H05B 3/02 (2006.01)

Patent

CA 2273820

The scribe line 4 is constituted by a large number of depressed portions of desired depth formed by radiation of a laser beam in a surface of the raw substrate correspondingly to a boundary line between adjacent insulating substrates so that the depressed portions are arranged in a line at fixed pitch intervals along the boundary line, and a portion where the pitch intervals of the depressed portions are reduced is provided over a desired length on the way of the scribe line, or a portion where the depth of the depressed portions is increased is provided over a desired length on the way of each of the scribe lines.

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