A semiconductor laser diode bar assembly

Details A semiconductor laser diode bar assembly A semiconductor laser diode bar assembly

H - Electricity

01

S

H01S 5/40 (2006.01) H01S 3/0941 (2006.01) H01S 5/024 (2006.01)

Patent

CA 2304859

A semiconductor laser diode bar assembly comprises a copper base plate (2) in which are mounted a plurality of heat pipes (3), for distributing heat within the base plate from a region under diode bar (4) mounted to the base plate. The assembly (1) is mounted on a heat sink (7) and electrically isolated from said heat sink by electrically insulating layer (7). Incorporation of the heat pipes into the base plate of the assembly, which base plate forms an electrode for the diode bar, results in more efficient cooling of the diode bar (4).

On décrit un ensemble barreau pour diode laser à semi-conducteur qui comprend une plaque support (2) en cuivre sur laquelle sont montés plusieurs caloducs (3) pour répartir la chaleur à l'intérieur de la plaque support à partir d'une région située au-dessous d'un barreau (4) monté sur la plaque support. L'ensemble (1) est monté sur un dissipateur de chaleur (7) et isolé électriquement de ce dernier par une couche isolante. L'intégration des caloducs dans la plaque support de l'ensemble (ladite plaque support formant une électrode pour le barreau de la diode) permet un refroidissement plus efficace du barreau de la diode (4).

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