A stainless steel sheet having cu-enriched grains dispersed...

C - Chemistry – Metallurgy – 22 – C

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C22C 38/20 (2006.01) C21D 1/26 (2006.01) C21D 6/00 (2006.01) C22C 38/04 (2006.01) C22C 38/42 (2006.01) C23C 8/18 (2006.01) C21D 8/02 (2006.01)

Patent

CA 2319974

A new stainless steel sheet has a stainless steel substrate 1 which contains Cu at a ratio of 1.0 mass % or more and has Cu-enriched grains 2 precipitated at a ratio of 0.2 vol.%. The Cu-enriched grains 2 are exposed outside through pinholes 4 of a passive film 3 generated on the substrate 1. Cu is preferably condensed at a Cu/(Cr+Si) mass ratio of 0.1 or more or a Cu/(Si+Mn) mass ratio of 0.5 or more with respect to Cr, Si and Mn present in the passive film 3 or at an outermost layer of the substrate 1. Precipitation of Cu-enriched grains 2 and condensation of Cu effectively improve solderability and electric conductivity of the stainless steel sheet 1.

Divulgation d'une nouvelle feuille d'acier inoxydable comportant un substrat d'acier inoxydable 1 ayant une teneur massique en cuivre de 1,0 % ou plus et des grains enrichis de cuivre 2 précipités à un rapport volumique de 0,2 %. Les grains enrichis de cuivre 2 sont exposés à l'extérieur par des piqûres 4 dans un film passif 3 généré sur le substrat 1. De préférence, le Cu est condensé dans un rapport massique Cu/(Cr+Si) de 0,1 ou plus ou dans un rapport massique Cu/(Cr+Mn) de 0,5 ou plus, rapports calculés avec le Cr, le Si et le Mn présents dans le film passif 3 ou dans une couche le plus à l'extérieur du substrat 1. La précipitation des grains enrichis de Cu 2 et la condensation du Cu améliorent de manière efficace la soudabilité et la conductibilité électrique de la feuille d'acier inoxydable 1.

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