A system and method for packaging integrated circuits

Details A system and method for packaging integrated circuits A system and method for packaging integrated circuits

H - Electricity

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H01L 21/44 (2006.01) H01L 21/48 (2006.01) H01L 21/50 (2006.01) H01L 21/66 (2006.01) H01L 23/498 (2006.01) H01L 25/065 (2006.01) H05K 1/11 (2006.01) H05K 1/14 (2006.01) H05K 1/18 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2290396

A system and method for efficiently interconnecting a plurality of ICs (10), thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling.

La présente invention concerne un système et un procédé permettant d'interconnecter de façon efficace plusieurs circuits intégrés (10) de manière que l'on améliore la performance électrique de tout le système tout en réduisant la dégradation des contacts provoquée par les contraintes résultant des différences de coefficients d'expansion thermique des différents composants au cours des variations cycliques de température.

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