A system to monitor the temperature of an integrated circuit...

H - Electricity – 01 – L

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H01L 23/467 (2006.01) G01K 13/00 (2006.01) G08B 19/00 (2006.01) G08B 21/18 (2006.01) H01L 23/34 (2006.01) H05K 7/20 (2006.01) G01F 1/34 (2006.01)

Patent

CA 2200251

A system to monitor the temperature of an integrated circuit and to dissipate heat generated thereby includes a heat sink to overlie the integrated circuit. A temperature sensor is located on the heat sink to detect the temperature adjacent the integrated circuit. Temperature signal conditioning circuitry is responsive to the temperature sensor and generates a temperature alarm signal when the temperature at the integrated circuit reaches a threshold level. A fan overlies the heat sink and draws air across and then away from the heat sink to cool it. A pressure transducer is mounted on the fan and detects air flow through the fan. Pressure signal conditioning circuitry is responsive to the pressure transducer and generates a pressure alarm signal when the air flow through the fan falls below a threshold level. Alarms are triggered by the temperature and pressure alarm signals to warn a user.

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