G - Physics
01
N
G01N 21/88 (2006.01) G01N 21/55 (2006.01) G01N 21/59 (2006.01) G01N 21/956 (2006.01) G01R 31/04 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2251511
Due to the in-accessibility of the solder joints in Area Array Components (such as BGA, PBGA, CGA, CCGA, etc) the current method of solder joint verification is through the use of X-ray scanning which involves very costly equipment. The proposed device uses a novel application of laser technology for the process which reduces the cost and the duration of the verification considerably.
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