Abrasive articles and methods for making same

Details Abrasive articles and methods for making same Abrasive articles and methods for making same

B - Operations, Transporting

24

D

B24D 3/28 (2006.01) C08J 5/00 (2006.01)

Patent

CA 2593840

The disclosure is directed to a radiation curable composition including abrasive grains and a binder composition. The binder composition includes about 10 wt% to about 90 wt% cationically polymerizable compound, not greater than about 40 wt% radically polymerizable compound, and about 5 wt% to about 80 wt% particulate filler based on the weight of the binder composition. The particulate filler includes dispersed submicron particulates.

L'invention concerne une composition durcissable par rayonnements renfermant des grains abrasifs et une composition de liant. Cette composition de liant contient entre environ 10 % et 90 % en poids d'un composé polymérisable au niveau cationique, pas plus d'environ 40 % en poids d'un composé polymérisable au niveau des radicaux, et entre environ 5 % et 80 % en poids d'une charge particulaire, en fonction du poids de la composition de liant. La charge particulaire renferme des particules submicroniques dispersées.

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