Abrasive pad for cmp

Details Abrasive pad for cmp Abrasive pad for cmp

B - Operations, Transporting

24

D

B24D 11/00 (2006.01) B24B 37/04 (2006.01) B24D 3/28 (2006.01) B24D 13/14 (2006.01)

Patent

CA 2416549

An abrasive pad for CMP has a substrate (12) and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three- dimensional structure including a plurality of regularly arranged three- dimensional elements (II) having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components.

L'invention concerne un corps abrasif pour polissage mécano-chimique (CMP : Chemical Mechanical Polishing), comprenant un substrat et une couche abrasive disposée sur le substrat. L'invention concerne plus particulièrement un corps abrasif pour CMP comprenant un substrat et une couche abrasive disposée sur le substrat, dont la couche abrasive présente une structure tridimensionnelle comprenant une pluralité d'éléments tridimensionnels disposés selon un arrangement régulier, et présentant une forme prédéterminée, cette couche abrasive comprenant un composite abrasif contenant, en tant que composants structurels, des grains abrasifs d'alumine améliorée, produits au moyen d'un procédé CVD (dépôt chimique en phase vapeur) et un liant.

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