Abrasive tools for grinding electronic components

Details Abrasive tools for grinding electronic components Abrasive tools for grinding electronic components

B - Operations, Transporting

24

D

B24D 3/32 (2006.01) B24D 3/34 (2006.01) B24D 5/00 (2006.01) B24D 7/00 (2006.01)

Patent

CA 2375956

Abrasive tools containing high concentrations of hollow filer materials in a resin bond are suitable for polishing and backgrinding of hard materials, such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain, such as diamond abrasive, along with the hollow filler material and resin bond, comprising a backing and an abrasive rim containing a maximum of about 2 to 15 volume percent abrasive grain, the abrasive grain having a maximum grit size of 60 microns, wherein the abrasive rim comprises resin bond and at least 40 volume percent hollow filler materials, and the abrasive grain and resin bond are present in the abrasive rim in a ratio of 1.5:1.0 to 0.3:1.0 grain to bond.

La présente invention concerne des outils abrasifs contenant une grande concentration de matériaux de remplissage dans une liaison de résine, qui conviennent pour le polissage et la rectification de matériaux durs, tels que des tranches de céramique et des composants nécessitant un contrôle du nombre de défauts de surface. Ces outils abrasifs très poreux comprennent un abrasif à grain fin, tel qu'un abrasif diamant, un matériau de remplissage et une liaison de résine, pourvue d'un dos et d'un rebord abrasif contenant environ 2 à 15 pour-cent en volume de grains abrasifs, le calibre maximum de ces grains étant de 60 microns. Le rebord abrasif comprend une liaison de résine et au moins 40 % en volume de matériaux de remplissage, et les grains abrasifs et la liaison de résine sont présents dans ce rebord abrasif dans un rapport grain/liaison de 1,5:1,0 à 0,3:1,0.

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