C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/38 (2006.01)
Patent
CA 2093924
The invention concerns an aqueous acid copper- electroplating bath and the use of the bath for the electrolytic deposition of copper.
Dahms Wolfgang
Westphal Horst
Atotech Deutschland Gmbh
Marks & Clerk
Schering Aktiengesellschaft
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