Acid bath for the galvanic deposition of copper, and the use...

Details Acid bath for the galvanic deposition of copper, and the use... Acid bath for the galvanic deposition of copper, and the use...

C - Chemistry, Metallurgy

25

D

C25D 3/38 (2006.01)

Patent

CA 2115062

The invention is directed to an aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. It is characterized by a content of polyalkylene glycol dialkyl ether. When combined with thio compounds containing water-soluble groups, these additions produce an electrolyte with excellent stability. polymeric phenazonium compounds, polymeric nitrogen compounds and/or thio compounds containing nitrogen may also be successfully combined, in addition, depending on the desired properties.

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