Acid copper electroplating baths containing brightening and...

Details Acid copper electroplating baths containing brightening and... Acid copper electroplating baths containing brightening and...

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01)

Patent

CA 1194832

ABSTRACT OF THE DISCLOSURE The invention is concerned with the electrodeposition of copper from an aqueous acidic bath containing the following additives: a. An alkylated polyalkyleneimine obtained as the reaction product of a polyalkyleneimine represented by the formula: H2N-(CH2)n-NH-R wherein R is H or (CH2)n NH2 and n = 1 to 6 with an epihalohydrin and an alkylat- ing agent; and optionally an organic sulfo sulfonate; a polyether; and/or a thio- organic compound. The novel aqueous acidic copper baths provide bright and leveled copper electrodeposits over a wide current density range including low current densities on the order of 0.4 amps. sq. dm. or less with strong leveling properties throughout.

403086

Affiliated with

Also associated with

Rating

Acid copper electroplating baths containing brightening and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Acid copper electroplating baths containing brightening and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Acid copper electroplating baths containing brightening and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1285643