Acid copper plating baths

Details Acid copper plating baths Acid copper plating baths

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01)

Patent

CA 1078323

ABSTRACT OF THE DISCLOSURE An acid plating bath and an improved process for electrodepositing level copper coatings are described. The improved copper plating baths and method include a bath soluble organic leveling compound which is obtained by reacting one or more epihalohydrins with one or more nitrogen-containing compounds which may be substituted pyridines, quinolines, isoquinoline or benzimidazole. Particularly improved results are obtained if the acid copper bath also contains, in addition to the leveling agent, a bath-soluble brightening agent and a wetting agent. The presence of the above-described leveling agent in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities.

270766

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