Acidic treatment liquid and method of treating copper surfaces

Details Acidic treatment liquid and method of treating copper surfaces Acidic treatment liquid and method of treating copper surfaces

C - Chemistry, Metallurgy

23

F

C23F 1/18 (2006.01) C23C 22/52 (2006.01) H05K 3/38 (2006.01) H05K 3/06 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2407532

The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five- membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected form the group comprising thioles A, disulfides B, sulfides, C and thioamides D having the respective general formulae wherein R1 and R2 = alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R3 = R1, R1-O, R1-S, amino or substituted amino, wherein R1 and R2 may especially be phenyl or substituted phenyl.

La présente invention concerne une solution et un procédé de traitement de surfaces de cuivre, les surfaces de cuivre étant mises en contact avec un liquide de traitement acide contenant du peroxyde d'hydrogène et au moins un composé hétérocyclique à cinq chaînons ainsi qu'au moins un agent modificateur de microstructure sélectionné dans le groupe composé des thiols A, des disulfures B, des sulfures C et des thioamides D représentés par les formules générales respectives dans lesquelles R?1¿ et R?2¿ = alkyle, alcényle, aryle, aralkyle, en particulier benzyle, cycloalkyle et leurs dérivés et R?3 ¿= R?1¿, R?1¿-O, R?1¿-S, amino ou amino substitué, R?1¿ et R?2¿ pouvant être en particulier phényle ou phényle substitué.

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