Acrylic-modified epoxy resin adhesive compositions with...

Details Acrylic-modified epoxy resin adhesive compositions with... Acrylic-modified epoxy resin adhesive compositions with...

C - Chemistry, Metallurgy

09

J

C09J 163/10 (2006.01) C08F 283/10 (2006.01) C09J 133/08 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2072090

2072090 9208760 PCTABS00013 A thixotropic adhesive composition exhibiting good sag resistance is prepared comprising a mixture of a polymer-modified epoxy resin and a rheological control agent. The polymer-modified epoxy resin is preferably a dispersion of acrylic elastomer in an epoxy resin in which the acrylic elastomer particles have added hydroxyl functionality which interacts favorably with rheological control agents, such as fumed silica. Acrylic epoxy resin dispersions containing added hydroxyl functionality give improved rheological control.

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