Activator solutions and process of preparation

Details Activator solutions and process of preparation Activator solutions and process of preparation

B - Operations, Transporting

01

J

252/84, 204/18.7

B01J 31/22 (2006.01) C23C 18/28 (2006.01)

Patent

CA 1037019

ABSTRACT OF THE DISCLOSURE Surface intended to be electrolessly metal plated, for instand? the surface of through holes of through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanol- modified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.

207545

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