Active device assembly

Details Active device assembly Active device assembly

G - Physics

02

F

G02F 1/03 (2006.01) G02F 1/035 (2006.01) G02F 1/225 (2006.01) G02F 1/313 (2006.01)

Patent

CA 2396484

Active device assembly comprising a substrate having at least a planar surface on which a plurality of electrical contact pads are formed, a chip having a surface on which at least one optical waveguide and a plurality of electrodes are formed. Said chip surface is in a facing relationship with the planar surface of the substrate, and said electrical contact pads are in electrical contact to said electrodes. Said contact pads and said electrodes provide mechanical connection between said chip and said substrate and the coefficient of thermal expansion of the substrate is greater than or equal to the coefficient of thermal expansion of the chip in a length direction.

Un ensemble dispositif actif comprend un substrat qui présente au moins une surface plane sur laquelle sont formées plusieurs plages de contact électrique et une puce sur la surface de laquelle sont formés au moins un guide d'ondes optiques et une pluralité d'électrodes. La surface de la puce est située en face de la surface plane du substrat et les plages de contact électrique se trouvent en contact électrique avec les électrodes. Les plages de contact et les électrodes assurent une connexion mécanique entre la puce et le substrat, le coefficient de dilatation thermique du substrat étant supérieur ou égal au coefficient de dilatation thermique de la puce dans le sens de la longueur.

Affiliated with

Also associated with

Rating

Active device assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Active device assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Active device assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1405714