Addition cured silicone pressure sensitive adhesive

Details Addition cured silicone pressure sensitive adhesive Addition cured silicone pressure sensitive adhesive

C - Chemistry, Metallurgy

08

L

117/31, 400/5184

C08L 83/04 (2006.01) C08L 83/06 (2006.01) C08L 83/07 (2006.01) C09J 7/02 (2006.01) C09J 183/04 (2006.01)

Patent

CA 2012232

6051-1084 ABSTRACT Compositions curable to pressure sensitive adhesives are disclosed which comprise from 30 to 50 parts or a vinyl endblocked polydiorganosiloxane fluid having a viscosity from 500 to 10,000 centipoise at 25°C, from 50 to 70 parts or a benzene soluble resin copolymer having R3SiO1/2 units and SiO4/2 units, an organopolysiloxane having silicon bonded hydrogen atoms for the purpose of curing the composition and developing the PSA properties, and a platinumcatalyst for the curing process.

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