C - Chemistry – Metallurgy – 11 – D
Patent
C - Chemistry, Metallurgy
11
D
C11D 3/37 (2006.01) C11D 1/94 (2006.01) C11D 3/08 (2006.01) C11D 3/12 (2006.01) C11D 3/18 (2006.01) C11D 9/36 (2006.01) C11D 10/04 (2006.01) C11D 17/00 (2006.01) C11D 17/06 (2006.01) C11D 1/12 (2006.01) C11D 1/90 (2006.01)
Patent
CA 2257116
The present invention relates to novel chip compositions comprising alkylene glycol, benefit agent and fumed silica. Use of chips comprising excess of alkylene glycol over benefit agent and fumed silica has been found to allow significant deposition of benefit agent without compromising processing. In a second embodiment, the invention comprises bar compositions comprising mixtures of the chips of the invention and chips containing defined surfactant systems. The invention further comprises a process for forming the chips of the invention and a method of enhancing deposition without compromising processing using the chips of the invention.
L'invention concerne de nouvelles compositions sous forme de copeaux comprenant de l'alkylène glycol, un agent optimisant et de la silice sublimée. L'utilisation de copeaux comprenant un excès d'alkylène glycol par rapport à l'agent optimisant et la silice sublimée permet d'assurer un dépôt significatif d'agent optimisant sans compromettre le traitement. Dans un deuxième mode de réalisation, l'invention concerne des compositions sous forme de pains comprenant des mélanges de copeaux selon l'invention et des copeaux contenant les systèmes de tensioactifs définis. L'invention concerne, en outre, un procédé pour former les copeaux selon l'invention et un procédé pour améliorer le dépôt sans compromettre le traitement utilisant les copeaux selon l'invention.
Dalton James Joseph
Farrell Terence James
Shafer Georgia Lynn
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Plc Unilever
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