Additive for improved electroplating process

C - Chemistry – Metallurgy – 25 – C

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204/30, 204/26.5

C25C 3/12 (2006.01) C25C 3/20 (2006.01) C25D 3/14 (2006.01)

Patent

CA 1081649

Abstract of the Disclosure - This invention relates to a process and composition for the preparation of an electrodeposit which contains; at least one metal selected from the group consisting of nickel and cobalt or binary or ternary alloys of the metals selected from nickel, iron, and cobalt; which comprises passing current from an anode to a cathode through an aqueous acidic electroplating solution containing at least one member selected from nickel compounds and cobalt compounds and which may additionally contain iron compounds providing nickel, cobalt and iron ions for electro- depositing nickel, cobalt, nickel-cobalt alloys, nickel-iron alloys, cobalt-iron alloys or nickel-iron-cobalt alloys; the improvement comprising the presence of 5x10-6 moles per liter to 0.5 moles per liter of a .beta.-substituted, .gamma.-substituted, or .beta.,.gamma.-disubstituted sulfone exhibiting the following generalized structural formula: Image wherein R represents alkyl, alkenyl, alkynyl, aryl, alkaryl, aralkyl, or the group Image R' represents hydrogen, R, or the group Image -i- R" represents -OH, -SO3H or salt thereof, or -COOH or salts or esters thereof; a, b, c, d, e, are independently integers 1 or 2; except when R" is -COOH "a" may be zero; for a time period sufficient to form a metal electroplate upon said cathode.

280702

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