C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 83/06 (2006.01) C08J 3/22 (2006.01) C08K 9/06 (2006.01) C08L 83/05 (2006.01)
Patent
CA 2361866
An additive for organic resin comprising a powder comprising (A) a liquid organopolysiloxane having at least 0.001 wt% of silicon-bonded hydrogen atoms and at least 50 dimethylsiloxy repeating units and (B) an inorganic powder; and an organic resin comprising the additive.
Additif pour résine organique comprenant une poudre composée (A) d'un organopolysiloxane liquide ayant au moins 0,001 % d'équivalent en poids d'atomes d'hydrogène à liaison silicium et au moins 50 unités dimethylsiloxiques et (B) une poudre inorganique; et une résine organique composant l'additif.
Furukawa Haruhiko
Morita Yoshitsugu
Shiromoto Koji
Ueki Hiroshi
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Dow Corning Toray Silicone Company Ltd.
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