Additive for robust metal ink formulations

Details Additive for robust metal ink formulations Additive for robust metal ink formulations

C - Chemistry, Metallurgy

08

L

C08L 83/04 (2006.01) C08K 3/08 (2006.01) C08K 7/18 (2006.01) C09D 11/00 (2006.01) H01L 21/288 (2006.01)

Patent

CA 2734937

A composition that may be an electronic circuit element includes a metal nanoparticle, a silicone modified polyacrylate compound and a solvent. The silicone modified polyacrylate compound may be a silicone modified polyacrylate compound with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, a silicone modified polyacrylate compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100°C to about 200°C.

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