Additive for zinc-copper electroplating

Details Additive for zinc-copper electroplating Additive for zinc-copper electroplating

C - Chemistry, Metallurgy

25

D

204/27

C25D 3/56 (2006.01) C25D 3/58 (2006.01)

Patent

CA 1043733

ADDITIVE FOR ZINC-COPPER ELECTROPLATING By Charles ?. Abbott ABSTRACT OF THE DISCLOSURE The present invention relates to additive for electro- plating baths used for the electrodeposition of zinc-copper alloys, and particularly to such alloys designed to be used as undercoats for subsequently applied metal coating. The improvement comprises additives for incorporation into conventional zinc-copper electro- lytes, comprising a mixture of a buffering agent selected from the group consisting of boric acid, alkali metal berates, alkali metal selected from the group consisting of nickel ion and cobalt ion, and ethylenediaminotetra acetic acid (as the alkali metal salt).

221743

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