Additive method for manufacturing printed circuit boards...

B - Operations – Transporting – 05 – D

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B05D 5/12 (2006.01) B05D 3/04 (2006.01) G03C 5/00 (2006.01) G03F 7/00 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1278625

ABSTRACT OF THE DISCLOSURE An additive process for making printed circuit boards utilizing aqueous alkaline strippable resists, in which a suitable insulating substrate is patterned with the resist, the resist-patterned substrate catalyzed to electroless metal deposition, the resist then stripped completely from the substrate, utilizing an aqueous alkaline solution, preferably containing a reducing agent, and the electroless metal then deposited over the areas of the substrate catalyzed in the desired pattern.

559561

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