C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
402/257, 400/591
C08F 236/06 (2006.01) C08F 283/10 (2006.01) C08L 9/02 (2006.01) C08L 37/00 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2016648
ADDUCTS OF AN HYDROXY-FREE ACRYLATE RESIN AND AN EPOXY RESIN Abstract of the Disclosure This invention provides an adduct of an epoxy resin and a hydroxy free acrylate resin. The novel adduct contains vinyl unsaturation and hence may be copolymerized with an ethylenically unsaturated monomer to provide a tough thermoset resin.
Ho Kam W.
Lam Patrick W.
Chisholm P. Scott
Ho Kam W.
Lam Patrick W.
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