Adhering process

Details Adhering process Adhering process

C - Chemistry, Metallurgy

08

J

400/1125

C08J 5/12 (2006.01) B32B 27/32 (2006.01) C08L 23/08 (2006.01) C08L 23/10 (2006.01) C08L 23/22 (2006.01) C09J 5/00 (2006.01) C09J 7/00 (2006.01) H01B 3/00 (2006.01)

Patent

CA 1296822

ADHERING PROCESS Abstract of the Disclosure A process is provided for affixing to a substrate a non-tacky, flexible layer consisting of a raw polymer mixture of a minor proportion of linear low density polyethylene or isotactic polypropylene and a major proportion of elastomeric polymer of which at least about 50 percent by weight is butyl rubber, by applying a stretching elongation to the flexible layer before application to the substrate. The process may be used in a wide variety of applications, for example, to cover metal parts, make repairs to cracked cover components and electrical wiring splicing and to repair leaks in pipes or hoses. - 1 -

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