C - Chemistry – Metallurgy – 07 – K
Patent
C - Chemistry, Metallurgy
07
K
C07K 7/04 (2006.01) A61K 38/06 (2006.01) A61K 38/08 (2006.01) C07K 5/08 (2006.01) C07K 14/705 (2006.01) A61K 38/00 (2006.01)
Patent
CA 2365949
The invention provides methods for modulating cell adhesion. The invention also provides novel adhesion modulatory peptides, substrates coated with such adhesion modulatory peptides and devices for modulation of target cell adhesion.
Cette invention, qui a trait à des méthodes permettant de moduler l'adhésion cellulaire, concerne également de nouveaux peptides modulant l'adhésion, des substrats revêtus de ces peptides et des dispositif permettant de moduler l'adhésion d'une cellule cible.
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Children's Medical Center Corporation
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