C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
18/183, 117/190,
C08L 51/04 (2006.01) C08F 257/02 (2006.01) C08F 279/02 (2006.01) C08J 5/06 (2006.01) C09J 151/04 (2006.01)
Patent
CA 1136304
ABSTRACT OF THE DISCLOSURE An agueous alkaline dispersion of a rubbery graft low gel vinyl pyridine copolymer and a water soluble, heat reactive phenolic resin is useful in forming an adhesive for bonding polyamide or polyester reinforcing elements or cords to rubber compounds or stocks. After dipping the polyamide or polyester cord in the the one-steps adhesive dip, the coated cord . After dipping, the polyamide or is heated to dry it and heat cure heat set the adhesive on the cord. Thereafter, the adhesive containing polyamide or polyester cord is combined with, or laminated to (calendered), a curable rubber compound and the resulting assembly is cured to form a composite in which the polyamide or polyester cord is bond to the rubber by the means of said adhesive.
344146
Omnova Solutions Inc.
Smart & Biggar
LandOfFree
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